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DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ

DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ is a published development and funding opportunity on Contexium. The donor or funder is STATE, DEPARTMENT OF. Applications close on 30 Oct 2026. The U.S. Department of State invites industry feedback on the attached draft solicitation documents for Diplomatic Platform Support Services II (DiPSS II) as we work to finalize the requirement. We welcome comments, questions, and recommendations on the scope, structure, and any other relevant infor…

Opportunity overview

Project name
DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ
STATE, DEPARTMENT OF logo
STATE, DEPARTMENT OF
Donor
STATE, DEPARTMENT OF

Key details

Opportunity start date
Opportunity end date

Summary

The U.S. Department of State invites industry feedback on the attached draft solicitation documents for Diplomatic Platform Support Services II...

Frequently asked questions

What is DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ?

DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ is a published development and funding opportunity on Contexium. The donor or funder is STATE, DEPARTMENT OF. Applications close on 30 Oct 2026. The U.S. Department of State invites industry feedback on the attached draft solicitation documents for Diplomatic Platform Support Services II (DiPSS II) as we work to finalize the requirement. We welcome comments, questions, and recommendations on the scope, structure, and any other relevant infor…

Who is funding DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ?

DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ is funded by STATE, DEPARTMENT OF.

When is the deadline to apply for DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ?

The application deadline is 30 Oct 2026 15:00 (UTC).

How can I apply for DRAFT - DIPLOMATIC PLATFORM SUPPORT SERVICES II (DiPSS II) IDIQ?

Create a free Contexium account to view the full opportunity details and submit an application via the marketplace.