M5000-264664 - Pix4D Mapper Photogrammetry Software
M5000-264664 - Pix4D Mapper Photogrammetry Software is a published development and funding opportunity on Contexium. The donor or funder is Department of Public Works and Government Services (PSPC). Project location(s): Canada. Applications close on 28 Sep 2026. Please note that late submissions will not be considered or accepted. Royal Canadian Mounted Police has a requirement for six licences of Pix4D Mapper Photogrammetry software with maintenance and support. This solicitation of offers is open only to Canadian suppliers.
Opportunity overview
- Project name
- M5000-264664 - Pix4D Mapper Photogrammetry Software
- Donor
- Department of Public Works and Government Services (PSPC)
Key details
- Opportunity start date
- Opportunity end date
- Project location(s)
- Canada
Summary
Frequently asked questions
What is M5000-264664 - Pix4D Mapper Photogrammetry Software?
M5000-264664 - Pix4D Mapper Photogrammetry Software is a published development and funding opportunity on Contexium. The donor or funder is Department of Public Works and Government Services (PSPC). Project location(s): Canada. Applications close on 28 Sep 2026. Please note that late submissions will not be considered or accepted. Royal Canadian Mounted Police has a requirement for six licences of Pix4D Mapper Photogrammetry software with maintenance and support. This solicitation of offers is open only to Canadian suppliers.
Who is funding M5000-264664 - Pix4D Mapper Photogrammetry Software?
M5000-264664 - Pix4D Mapper Photogrammetry Software is funded by Department of Public Works and Government Services (PSPC).
When is the deadline to apply for M5000-264664 - Pix4D Mapper Photogrammetry Software?
The application deadline is 28 Sep 2026 18:00 (UTC).
Where will the M5000-264664 - Pix4D Mapper Photogrammetry Software project take place?
The project location(s) are: Canada.
How can I apply for M5000-264664 - Pix4D Mapper Photogrammetry Software?
Create a free Contexium account to view the full opportunity details and submit an application via the marketplace.