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High Purity Alloy Material for Brazing

High Purity Alloy Material for Brazing is a published development and funding opportunity on Contexium. The donor or funder is ENERGY, DEPARTMENT OF. Project location(s): United States. Applications close on 25 Sep 2026. 40 pieces 50Au-50Cu, grade 1 alloy; 0.040" diam. wire; formed into ring, 5.813" OD, gap = 0.02" max. 12 pieces 50Au-50Cu, grade 1 alloy; 0.040" diam. wire; formed into ring, 6.125" OD, gap = 0.02" max. 12 pieces 50Au-50Cu, grade 1 alloy; 0.040" diam. wire; formed into ring, 6.004" OD, gap = 0.02" ma…

Opportunity overview

Project name
High Purity Alloy Material for Brazing
ENERGY, DEPARTMENT OF logo
ENERGY, DEPARTMENT OF
Donor
ENERGY, DEPARTMENT OF

Key details

Opportunity start date
Opportunity end date
Project location(s)
United States

Summary

40 pieces 50Au-50Cu, grade 1 alloy; 0.040" diam. wire; formed into ring, 5.813" OD, gap = 0.02" max. 12 pieces...

Frequently asked questions

What is High Purity Alloy Material for Brazing?

High Purity Alloy Material for Brazing is a published development and funding opportunity on Contexium. The donor or funder is ENERGY, DEPARTMENT OF. Project location(s): United States. Applications close on 25 Sep 2026. 40 pieces 50Au-50Cu, grade 1 alloy; 0.040" diam. wire; formed into ring, 5.813" OD, gap = 0.02" max. 12 pieces 50Au-50Cu, grade 1 alloy; 0.040" diam. wire; formed into ring, 6.125" OD, gap = 0.02" max. 12 pieces 50Au-50Cu, grade 1 alloy; 0.040" diam. wire; formed into ring, 6.004" OD, gap = 0.02" ma…

Who is funding High Purity Alloy Material for Brazing?

High Purity Alloy Material for Brazing is funded by ENERGY, DEPARTMENT OF.

When is the deadline to apply for High Purity Alloy Material for Brazing?

The application deadline is 25 Sep 2026 23:59 (UTC).

Where will the High Purity Alloy Material for Brazing project take place?

The project location(s) are: United States.

How can I apply for High Purity Alloy Material for Brazing?

Create a free Contexium account to view the full opportunity details and submit an application via the marketplace.